- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/49 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions wire-like
Patent holdings for IPC class H01L 23/49
Total number of patents in this class: 734
10-year publication summary
|
44
|
51
|
65
|
76
|
98
|
88
|
61
|
61
|
44
|
9
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Intel Corporation | 45621 |
29 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
28 |
| Advanced Semiconductor Engineering, Inc. | 1546 |
26 |
| Texas Instruments Incorporated | 19376 |
22 |
| Samsung Electronics Co., Ltd. | 131630 |
21 |
| Mitsubishi Electric Corporation | 43934 |
20 |
| Fuji Electric Co., Ltd. | 4750 |
19 |
| Invensas Corporation | 645 |
17 |
| Micron Technology, Inc. | 24960 |
15 |
| Rohm Co., Ltd. | 5843 |
15 |
| Infineon Technologies AG | 8189 |
14 |
| Rosenberger Hochfrequenztechnik GmbH & Co. KG | 677 |
12 |
| Semiconductor Components Industries, L.L.C. | 5345 |
11 |
| Boe Technology Group Co., Ltd. | 35384 |
10 |
| STATS ChipPAC Pte. Lte. | 1516 |
10 |
| Heraeus Materials Singapore, PTE., Ltd. | 39 |
9 |
| Renesas Electronics Corporation | 6305 |
8 |
| International Business Machines Corporation | 60644 |
7 |
| Robert Bosch GmbH | 40953 |
7 |
| Huawei Technologies Co., Ltd. | 100781 |
7 |
| Other owners | 427 |